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 Advance Product Information
April 4, 2006
9.9 - 12.5 Gb/s Optical Modulator Driver
* * * * * * *
TGA4954-SL
Wide Drive Range (3V to 10V) Single-Ended Input/Output Low Power Dissipation (1.1W @ 6Vo) Low Rail Ripple 25psec Edge Rates (20/80%) Hot-pluggable Package Dimensions: 11.4 x 8.9 x 2.0 mm (0.450 x 0.350 x 0.080 inches)
Key Features and Performance
Product Description
The TriQuint TGA4954-SL is part of a series of surface mount modulator drivers suitable for a variety of driver applications and is compatible with Metro MSA standards. The 4954 consists of two high performance wideband amplifiers combined with off chip circuitry assembled in a surface mount package. A single 4954 placed between the MUX and Optical Modulator provides OEMs with a board level modulator driver surface mount solution. The 4954 provides Metro and Long Haul designers with system critical features such as: low power dissipation (1.2W at Vo = 6V), low rail ripple, high voltage drive capability at 5V bias (6 V amplitude adjustable to 3 V), low output jitter, and low input drive sensitivity (250mV at Vo = 6V). The 4954 requires external DC blocks, a low frequency choke, and control circuitry. Evaluation boards available upon request. Lead Free & RoHS compliant.
36 32 28 24 S21 (dB) 20 16 12 8 4 0 0 S21 S11 S22
Primary Applications
* Mach-Zehnder Modulator Driver
Measured Data
Vdd=5V; Id1=65mA; Id2=115mA; Vctrl1=-0.2V; Vctrl2=+0.2V
15 10 5 S11,S22 (dB) 0 -5 -10 -15 -20 -25 -30 5 10 Frequency (GHz) 15 20
Vout=6Vpp
Note: This device is early in the characterization process prior to finalizing all electrical test specifications. Specifications are subject to change without notice. 1
TriQuint Semiconductor Texas Phone: (972)994-8465 Fax: (972)994 8504 Email: info-mmw@tqs.com Web: www.triquint.com
Advance Product Information
April 4, 2006
TGA4954-SL
TABLE I MAXIMUM RATINGS Symbol VD1 VD2 VG1 VG2 VCTRL1 VCTRL2 ID1 ID2 | IG1 | | IG2 | | ICTRL1 | | ICTRL2 | PIN VIN PD TCH TM TSTG 1/ 2/ 3/ 4/ Drain Voltage Gate Voltage Range Control Voltage Range Drain Supply Current (Quiescent) Gate Supply Current Control Supply Current Input Continuous Wave Power 12.5Gb/s PRBS Input Voltage Power Dissipation Operating Channel Temperature Mounting Temperature (10 Seconds) Storage Temperature Parameter Value 8V -3V to 0V -3V to VD 200 mA 350 mA 15 mA 15 mA 23 dBm 4 VPP 4W 150 C 230 C -65 to 150 C
0 0 0
Notes 1/ 2/ 1/ 1/ 1/ 2/ 1/ 1/ 5/ 1/ 2/ 1/ 2/ 1/ 2/ 3/ 4/
These ratings represent the maximum operable values for this device Combinations of supply voltage, supply current, input power, and output power shall not exceed PD at a package base temperature of 80C When operated at this bias condition with a baseplate temperature of 80C, the MTTF is reduced Junction operating temperature will directly affect the device median time to failure (MTTF). For maximum life, it is recommended that junction temperatures be maintained at the lowest possible levels. Assure VCTRL1 never exceeds VD1, and VCTRL2 never exceeds VD2 during bias up and down sequences.
5/
2
TriQuint Semiconductor Texas Phone: (972)994-8465 Fax: (972)994 8504 Email: info-mmw@tqs.com Web: www.triquint.com
Advance Product Information
April 4, 2006
TABLE II THERMAL INFORMATION Parameter RJC Thermal Resistance (Channel to Backside of Package) Test Conditions VDD = 5V IDD = 215mA PDISS = 1.08W TBASE = 70C TCH (C) 92 RJC (C/W) 20.4
TGA4954-SL
MTTF (hrs) >1E6
Note: Thermal transfer is conducted through the bottom of the TGA4954-SL package into the motherboard. The motherboard must be designed to assure adequate thermal transfer to the base plate.
TABLE III RF CHARACTERIZATION TABLE (TA = 25C, Nominal) Parameter Small Signal Bandwidth Saturated Power Bandwidth 0.1, 2, 4 GHz 6 GHz 10 GHz 14 GHz 16 GHz 0.1, 2, 4, 6, 10, 14, 16 GHz 0.1, 2, 4, 6, 10, 14, 16 GHz 3 GHz 28 26 24 17 12 10 Test Conditions Min Typ Max Units Notes
8
GHz
12 34 33 30 25 21 15
GHz
Small Signal Gain
dB
1/
Input Return Loss Output Return Loss Noise Figure Small Signal AGC Range Saturated Output Power
dB
1/
10
15
dB
1/
2.5
dB
Midband
28
dB
2, 4, 6, 8 & 10 GHz
24
26.5
dBm
6/ 7/
3
TriQuint Semiconductor Texas Phone: (972)994-8465 Fax: (972)994 8504 Email: info-mmw@tqs.com Web: www.triquint.com
Advance Product Information
April 4, 2006
TABLE III (Continued) RF CHARACTERIZATION TABLE (TA = 25C, Nominal) Parameter Test Conditions VD2 = 8.0V VD2 = 6.5V VD2 = 5.5V VD2 = 4.5V VD2 = 4.0V VIN = 500mVPP VIN = 800mVPP VIN = 250mVPP VIN = 500mVPP VIN = 800mVPP 250mVPP 800mVPP 250mVPP 800mVPP -0.50 -0.50 -0.1 0.0 25 25 25 Min 9.0 7.0 6.0 5.5 5.0 1.2 1.4 39 42 42 10.0 8.0 0.50 0.50 3.0 3.0 Typ Max
TGA4954-SL
Units
Notes
Eye Amplitude
VPP
2/
Additive Jitter (RMS) Q-Factor Delta Crossing Percentage Delta Eye Amplitude
psec
5/
V/V
%
VPP
Table III Notes:
1/ Package RF Bias: VDD = 5V, adjust VG1 to achieve ID1 = 65mA then adjust VG2 to achieve ID2 = 115mA, VCTRL1 = -0.2V & VCTRL2 = +0.2 V 2/ VIN = 250mV, Data Rate = 10.7Gb/s, VD1 = VD2 or greater, VCTRL2 and VG2 are adjusted for maximum output 5/ Computed using RSS Method where JRMS_DUT = (JRMS_TOTAL2 - JRMS_SOURCE2) 6/ Verified at die level on-wafer probe 7/ Power Bias Die Probe: VTEE = 8V, adjust VG to achieve ID = 175mA 5%, VCTRL = +1.5V 8/ Value is the difference with the 500mV input measurement. Result is the absolute value. Note: At the die level, drain bias is applied through the RF output port using a bias tee, voltage is at the DC input to the bias tee
4
TriQuint Semiconductor Texas Phone: (972)994-8465 Fax: (972)994 8504 Email: info-mmw@tqs.com Web: www.triquint.com
Advance Product Information
April 4, 2006
Measured Data
36 32 28 24 S21 (dB) 20 16 12 8 4 0 0 0 -5 -10 S11,S22 (dB) -15 -20 -25 -30 -35 -40 0 2 4 6 8 10 12 14 16 S11 S22 2 4 6 8 10 12 14 16
TGA4954-SL
Vdd=5V; Id1=65mA; Id2=115mA; Vctrl1=-0.2V; Vctrl2=+0.2V
18
20
Frequency (GHz)
18
20
Frequency (GHz)
5
TriQuint Semiconductor Texas Phone: (972)994-8465 Fax: (972)994 8504 Email: info-mmw@tqs.com Web: www.triquint.com
Advance Product Information
April 4, 2006
Measured Data
TGA4954-SL
Vdd=5V; Id1=65mA; Vctrl1=-0.2V; Vin=500mVpp; Vo=6Vpp Vg2 & Vctrl2 are varied to achieve 6Vo & 50% crossing 9.953Gbps 10.7Gbps
11.3Gbps
12.5Gbps
6
TriQuint Semiconductor Texas Phone: (972)994-8465 Fax: (972)994 8504 Email: info-mmw@tqs.com Web: www.triquint.com
Advance Product Information
April 4, 2006
Measured Data
TGA4954-SL
Vdd=5V; Id1=65mA; Vctrl1=-0.2V; Vo=6Vpp; 10.7Gbps Vg2 & Vctrl2 are varied to achieve 6Vo & 50% crossing Vin=250mVpp Vin=500mVpp
Vin=800mVpp
7
TriQuint Semiconductor Texas Phone: (972)994-8465 Fax: (972)994 8504 Email: info-mmw@tqs.com Web: www.triquint.com
Advance Product Information
April 4, 2006
Measured Data
TGA4954-SL
Vdd=5V; Id1=65mA; Vctrl1=-0.2V; Vin=500mVpp; 10.7Gbps Vg2 & Vctrl2 are varied to achieve 6Vo & 50% crossing 3Vo 4Vo
5Vo
6Vo
Input
8
TriQuint Semiconductor Texas Phone: (972)994-8465 Fax: (972)994 8504 Email: info-mmw@tqs.com Web: www.triquint.com
Advance Product Information
April 4, 2006
TGA4954-SL
TGA4954 Typical Performance Data Measured in a Test Fixture
Idd Vdd Id1 Test Fixture Id2
4954 SMT Driver RF(in) RF(out)
Vctrl1 Vg1
Vctrl2
Vg2
Test Fixture Block Diagram
9
TriQuint Semiconductor Texas Phone: (972)994-8465 Fax: (972)994 8504 Email: info-mmw@tqs.com Web: www.triquint.com
Advance Product Information
April 4, 2006
TGA4954-SL
Production - Initial Alignment - Bias Procedure
Vdd=5V, Vo=6Vamp, CPC=50% (Hot-Pluggable)
Bias Network Initial Conditions Vg1=-1.5V Vg2=-1.5V Vctrl1=-0.2V Vctrl2=+.1V Vdd=5V
1. Remove Vdd. 1. Disable the output of MUX 2. Remove Vg1, Vg2, Vctrl1 and Vctrl2 2. Apply Vg1, Vg2, Vctrl1 and Vctrl2 in any sequence. in any sequence. 3. Apply Vdd. 4. Make Vg1 more positive until Idd=65mA. - This is Id1 (current into the first stage) - Typical value for Vg1 is -0.65V 5. Make Vg2 more positive until Idd=180mA. - This sets Id2 to 115mA. - Typical value for Vg2 is -0.55V 6. Enable the output of the MUX. - Set Vin=500mV 7. Output Swing Adjust: Adjust Vctrl2 slightly positive to increase output swing or adjust Vctrl2 slightly negative to decrease the output swing. - Typical value for Vctrl2 is +0.22V for Vo=6V. 8. Crossover Adjust: Adjust Vg2 slightly positive to push the crossover down or adjust Vg2 slightly negative to push the crossover up. - Typical value for Vg2 is -0.57V to center crossover with Vo=6V.
Bias ON
Bias OFF
10
TriQuint Semiconductor Texas Phone: (972)994-8465 Fax: (972)994 8504 Email: info-mmw@tqs.com Web: www.triquint.com
Advance Product Information
April 4, 2006
TGA4954-SL
Production - Post Alignment - Bias Procedure
Vdd=5V, Vo=6Vamp, CPC=50% (Hot-Pluggable)
Bias Network Initial Conditions Vg1= As found during initial alignment Vg2=-As found during initial alignment Vctrl1=-0.2V Vctrl2=As found during initial alignment Vdd=5V
Bias ON
1. Mux output can be either Enabled or Disabled 2. Apply Vg1, Vg2, Vctrl1 and Vctrl2 in any sequence. 3. Apply Vdd. 4. Enable the output of the MUX 5. Output Swing Adjust: Adjust Vctrl2 slightly positive to increase output swing or adjust Vctrl2 slightly negative to decrease the output swing. 6. Crossover Adjust: Adjust Vg2 slightly positive to push the crossover down or adjust Vg2 slightly negative to push the crossover up.
Bias OFF
1. Remove Vdd. 2. Remove Vg1, Vg2, Vctrl1 and Vctrl2 in any sequence.
11
TriQuint Semiconductor Texas Phone: (972)994-8465 Fax: (972)994 8504 Email: info-mmw@tqs.com Web: www.triquint.com
Advance Product Information
April 4, 2006
Mechanical Drawing
0.047 0.127 0.207 0.327 0.407 0.438
TGA4954-SL
0.350
10 11 12 13 14
15 16 17
0.327
0.177 0.175
9 19 18
0.175
0.024 0.000
8
7
6
5
4
3
2
1
0.080 REF.
0.367 0.412 0.450 LID 0.020 SIDEWALL
0.000 0.017 0.087
0.167
Bond Pad #1 Bond Pad #2 Bond Pad #3 Bond Pad #4 Bond Pad #5 Bond Pad #6 Bond Pad #7 Bond Pad #8 Bond Pad #9
N/C N/C Vg1 N/C N/C Vg2 N/C N/C RF Out
0.025 x 0.041 0.018 x 0.041 0.018 x 0.041 0.018 x 0.041 0.018 x 0.041 0.018 x 0.041 0.018 x 0.041 0.018 x 0.041 0.027 x 0.018
0.236
Bond Pad #10 Bond Pad #11 Bond Pad #12 Bond Pad #13 Bond Pad #14 Bond Pad #15 Bond Pad #16 Bond Pad #17 Bond Pad #18 Bond Pad #19
N/C N/C Vd2 N/C Vctrl2 Vd1 N/C Vctrl1 RF In GND
0.018 x 0.041 0.018 x 0.041 0.018 x 0.041 0.018 x 0.041 0.018 x 0.041 0.018 x 0.041 0.018 x 0.041 0.018 x 0.041 0.020 x 0.018 0.335 x 0.206
12
TriQuint Semiconductor Texas Phone: (972)994-8465 Fax: (972)994 8504 Email: info-mmw@tqs.com Web: www.triquint.com
Advance Product Information
April 4, 2006
Application Circuit
TGA4954-SL
Recommended Components:
DESIGNATOR C1, C2 C3, C4, C5 C6, C7 C8 L1 L2 R1, R2 DESCRIPTION DC Block, Broadband 10uF Capacitor MLC Ceramic 0.01 uFCapacitor MLC Ceramic 10 uF Capacitor Tantalum 220 uH Inductor 330 nH Inductor 274 Resistor MANUFACTURER Presidio AVX AVX AVX Belfuse Panasonic Panasonic PART NUMBER BB0502X7R104M16VNT9820 0802YC106KAT 0603YC103KAT TAJA106K016R S581-4000-14 ELJ-FAR33MF2 ERJ-2RKF2740X
Notes:
1. C3 and C4 extend low frequency performance thru 30 KHz. For applications requiring low frequency performance thru 100 kHz, C3 and C4 may be omitted 2. C6 and C7 are power supply decoupling capacitors and may be omitted when driven directly with an opamp. Impedance looking into VCTRL1 and VCTRL2 is 10k real
13
TriQuint Semiconductor Texas Phone: (972)994-8465 Fax: (972)994 8504 Email: info-mmw@tqs.com Web: www.triquint.com
Advance Product Information
April 4, 2006
TGA4954-SL
Recommended Surface Mount Package Assembly
Proper ESD precautions must be followed while handling packages. Clean the board with acetone. Rinse with alcohol. Allow the circuit to fully dry. TriQuint recommends using a conductive solder paste for attachment. Follow solder paste and reflow oven vendors' recommendations when developing a solder reflow profile. Typical solder reflow profiles are listed in the table below. Hand soldering is not recommended. Solder paste can be applied using a stencil printer or dot placement. The volume of solder paste depends on PCB and component layout and should be well controlled to ensure consistent mechanical and electrical performance. This package has little tendency to self-align during reflow. Clean the assembly with alcohol.
Typical Solder Reflow Profiles
Reflow Profile
Ramp-up Rate Activation Time and Temperature Time above Melting Point Max Peak Temperature Time within 5 C of Peak Temperature Ramp-down Rate
SnPb
3 C/sec 60 - 120 sec @ 140 - 160 C 60 - 150 sec 240 C 10 - 20 sec 4 - 6 C/sec
Pb Free
3 C/sec 60 - 180 sec @ 150 - 200 C 60 - 150 sec 260 C 10 - 20 sec 4 - 6 C/sec
Ordering Information
Part TGA4954-SL Package Style Land Grid Array Surface Mount
GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should be observed during handling, assembly and test.
14
TriQuint Semiconductor Texas Phone: (972)994-8465 Fax: (972)994 8504 Email: info-mmw@tqs.com Web: www.triquint.com


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